| Mar 2024 |
Globetronics (via subsidiary ISO Technology) |
Malaysia |
Technology provision agreement |
OSAT technical services, valued at ~$7.59mn (~RM35.9mn); ISO Tech also agreed to reinvest ~$5.28mn into Kaynes Semicon securities, with an IPO/strategic-sale exit obligation within 3 years |
Confirmed, executed |
| ~2024 (reported alongside Globetronics) |
Aptos Technologies |
Taiwan |
Technology partner |
One of three named OSAT packaging technology partners (alongside Globetronics, AOI) |
Reported by company/CEO, not independently verified via filing |
| ~2024 |
AOI Electronics |
Japan |
Technology partner (initial) |
Backend packaging technical partner from the outset; later deepened (see Dec 2025 below) |
Confirmed |
| 2024 (reported) |
Mixx Technologies |
USA (California) |
Minority equity investment |
Kaynes’ early-stage investment in an optical-interconnect deep-tech firm |
Confirmed by CEO interview; relationship expanded materially in 2026 (see below) |
| Sept 23, 2024 |
Government of India (Union Cabinet) |
India |
Regulatory approval, not a JV |
Approval for Sanand OSAT unit, ₹3,300–3,307 crore investment, 6 million chips/day capacity |
Confirmed (BSE/exchange filing + PIB) |
| Early–mid 2025 |
Mitsui & Co. (with AOI Electronics) |
Japan |
Strategic business partnership |
Facilitated OSAT launch; exclusive rights to source raw materials (lead frames, molding compounds, die-attach materials, specialty gases, chemicals) from Japan/global suppliers; also coordinates sales of Kaynes-produced items; Mitsui holds an option to acquire Kaynes Semicon shares later |
Confirmed |
| ~Apr 2025 |
Alpha & Omega Semiconductor (AOS), USA |
USA |
Multi-year customer/offtake agreement |
5-year agreement; AOS to use ~60% of Phase-1 capacity for IGBT, IPM, power MOSFET packaging/testing |
Confirmed; already generating shipments (see Oct 2025, Apr 2026) |
| Jun 2025 |
Fujitsu General Electronics (FGEL) |
Japan |
Acquisition (asset transfer) |
Fujitsu’s power-modules business sold for ~¥2bn (~₹118 crore); the business itself went to L&T Semiconductor Technologies, while the production facilities/lines transferred to Kaynes Semicon, which manufactures on contract for L&T |
Confirmed; physical relocation to Sanand phased over 12–18 months |
| Sept 1, 2025 |
US Technology International (UST) |
India/USA |
Equity-linked agreement (SSSA) |
Kaynes Semicon to issue Compulsorily Convertible Preference Shares to UST, convertible into up to 10% equity, tied to revenue milestones |
Confirmed (exchange filing) |
| Sept 2–4, 2025 (Semicon India 2025) |
Infineon Technologies |
Germany |
MoU |
Kaynes to launch India’s first “Made in India” MEMS microphone using Infineon bare-die tech (targeting TWS earbuds); Infineon also to supply power bare-die wafers for Kaynes to package |
Confirmed |
| Sept 2–4, 2025 |
SPARSH-IQ Solutions, 3rdiTech, Focally, SenseSemi Technologies |
India |
Consortium MoU |
Design, build and validate an indigenous automotive/industrial AI vision camera module entirely in India |
Confirmed (announced), execution stage unclear |
| Sept 2–4, 2025 |
Emerson (NI Semiconductor Test business) |
USA |
Technology/equipment agreement |
Deployment of Emerson’s NI Semiconductor Test System (STS) as preferred test platform across analog, mixed-signal, RF, power, MEMS devices |
Confirmed (announced) |
| Sept 2–4, 2025 |
Mirrorcle Technologies |
USA |
MoU |
Produce MEMS mirrors in India |
Confirmed (announced), early stage |
| Sept 2–4, 2025 |
Caligo Technology, FermionIC (DLI-scheme design startups) |
India |
Collaboration |
Advanced packaging collaboration with India-based chip-design startups |
Confirmed (announced) |
| ~Sept 2025 (brokerage-referenced) |
Lightspeed Photonics |
— |
Customer MoU |
Advanced packaging solutions customer |
Reported via brokerage note, not independently corroborated by a primary filing in my search |
| Dec 2025 |
AOI Electronics (deepened) |
Japan |
Technology collaboration |
Access to advanced backend know-how: advanced packaging, panel-level packaging, wafer-level redistribution layer (RDL) technologies |
Confirmed |
| Jan 2026 |
SEALSQ / WISeKey International |
Switzerland/USA (SEALSQ) |
Joint Venture (LOI/term sheet) |
SEALKAYNESQ JV — SEALSQ 51% / Kaynes Semicon 49%; Outsourced Semiconductor Test & Personalization (OSTP) facility inside Sanand site; PKI + post-quantum cryptography (PQC) personalization for national-security-grade applications |
LOI/term sheet signed Jan 2026; JV entity formation “in process” as of April 2026 — not yet a fully operational, formally incorporated JV per the most recent update I found |
| ~Feb 2026 (referenced) |
Fibocom |
China |
Manufacturing partnership |
Reported as a Kaynes Technology (parent-level, not Kaynes Semicon-specific) manufacturing tie-up |
Low-confidence, single secondary source; flagging for your awareness but not treating as an OSAT/semicon JV |
| Mar 31, 2026 |
— |
India |
Facility inauguration (not a JV) |
PM Modi formally inaugurates the Sanand OSAT plant |
Confirmed |
| Apr 14–15, 2026 |
Alpha & Omega Semiconductor (AOS) |
USA |
Commercial production milestone |
Commencement of commercial production of Intelligent Power Module (IPM5) products at Sanand, under the existing AOS agreement |
Confirmed |
| Jul 23, 2026 |
Mixx Technologies (with acquired Sophic Silicon Technologies) |
USA/India |
Manufacturing collaboration |
Multi-year collaboration to establish a test-and-assembly facility for optical IC packaging (co-packaged optics for AI infrastructure); separate from Kaynes’ earlier minority investment in Mixx |
Confirmed — most recent, just one week before this conversation |